SMT Assembly
Surface Mount
Bytec has invested in surface mount technology (SMT) equipment enabling component placement down to 0402 package. Maximum efficiency is achieved by CAE programming in addition to flexible placement platforms, capable of achieving in excess of 3000 components per hour (CPH). The modular feeder system enables machine changeover time to be minimised.
The SMT placement capabilities include:
- Double and single side reflow
- down to 0402 package
- ICs
- Switches
- Connectors
Bytec utilises camera inspection at the input to the SMT process and optical component alignment and fiducial correction through the assembly process.
Solder paste stencil hygiene is critical to ensure consistency of the application process.
In the even increasing competitiveness of this market area, Bytec actively works with our clients to reduce cost; as quantities increase, or forecasts are established, far east outsourcing becomes a real possibility. Bytec has a network of approved suppliers, we are not matched to any specific company, but use the most appropriate for the type, quantity and lead time required. Bytec can provide the benefits of no hassle local support with significant cost reduction.
Conformal Coating
Conformal coatings can protect the operational integrity of the printed circuit board assembly, especially where high reliability or exposure to harsh operating environments are expected, often typical of Aerospace, Defence, Medical and harsh Industrial applications.
Following component masking, boards undergo manual conformal coating.
Functional Testing
Bytec has the experience and capability of providing our customers with cost effective total test solutions. From in-process inspection through to customised fully functional test jigs. Bytec has the skill sets to ensure the highest levels of product quality.
The in-house test department provides functional test, while external partners complement this with a more specific test strategy.
